Question
I'm facing a challenge with Tizen development on my ARM-based computer since the Tizen SDK is only available for x86 and amd64 architectures.
Key issues:
- I can compile ARM binaries using my local GCC on Linux ARM distro
- The main problem is packaging the binary into a TPK file without the SDK
Specific questions:
- Can I manually create TPK files without the SDK?
- How to handle the package signing process manually?
- Is it possible to use zip and rename to .tpk?
- Where can I find detailed specifications about TPK file internals?
I've tried creating manifest.xml, layout.xml, and res.xml files, but the packaging and signing process remains unclear. Any guidance would be greatly appreciated.
Answer
Problem Understanding
The user needs to package Tizen applications into TPK files without using the official Tizen SDK, specifically on an ARM-based development machine.
Solution Methods
-
Cross-compilation Approach:
- Use the Git Build System (GBS) for cross-compiling Tizen packages
- Reference: GBS documentation
- Build instructions: Building Packages Locally with GBS
-
Manual Packaging Process:
- Create the necessary XML files (manifest.xml, layout.xml, res.xml)
- Package contents using standard zip format
- Note: Manual signing might require additional tools and certificates
-
Alternative Installation Method:
- For unsigned packages, manual installation via USB/SSH might be required
- This bypasses the need for official store signing
Additional Tips
- The TPK format is essentially a zip file with specific structure and metadata
- Consider using the open-source components from Tizen's source repository
- Be aware that manual packaging might limit some distribution options
- For production apps, consider using a compatible x86 machine for final packaging